Title:
ダイカスト用金型
Document Type and Number:
Japanese Patent JP7164274
Kind Code:
B2
Abstract:
Provided is a low-cost mold (1) for die-casting in which thermal stress that is generated in the mold is reduced or suppressed so that cracking and chipping of the mold are prevented over a long period of time and in which, even if cracking does occur, it is possible to extend the repairing cycle of the mold. In a first cavity formation surface (42a) and a first runner formation surface (42b) of the mold (1) for die-casting, a large number of recessed strip grooves (6) extending in a grid pattern along the first cavity formation surface (42a) and the first runner formation surface (42b) are formed. The distance (P) between two adjacent recessed strip grooves (6) extending parallel to each other among the recessed strip grooves (6) is set so as to satisfy 3 mm ≤ P ≤ 30 mm.
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Inventors:
Yusuke Murata
Eiji Fukube
Ryuichi Koikawa
Eiji Fukube
Ryuichi Koikawa
Application Number:
JP2018151038A
Publication Date:
November 01, 2022
Filing Date:
August 10, 2018
Export Citation:
Assignee:
Hiroshima Aluminum Industry Co., Ltd.
International Classes:
B22D17/22; B22C9/06
Domestic Patent References:
| JP2000197958A | ||||
| JP11090609A |
Foreign References:
| CN1597241A |
Attorney, Agent or Firm:
Katsumi Iseki
Wataru Onishi
Wataru Onishi