Title:
接着体の使用方法
Document Type and Number:
Japanese Patent JP5812863
Kind Code:
B2
Abstract:
Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250° C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30° C. to 250° C. at a temperature increase rate of 10° C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250° C. or higher.
Inventors:
Hiroyuki Kurimura
Isamu Ichikawa
Takayuki Nagumo
Takano Hoshino
Jun Watanabe
Isamu Ichikawa
Takayuki Nagumo
Takano Hoshino
Jun Watanabe
Application Number:
JP2011537285A
Publication Date:
November 17, 2015
Filing Date:
October 20, 2010
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KABUSHIKI KAISHA
International Classes:
C08F20/20; C08F2/50; C09J4/02; C09J5/00; C09J11/06
Domestic Patent References:
| JPH08335767A | 1996-12-17 | |||
| JP2002338936A | 2002-11-27 | |||
| JP2004285244A | 2004-10-14 | |||
| JP2000249826A | 2000-09-14 | |||
| JP2004035847A | 2004-02-05 | |||
| JP2009040924A | 2009-02-26 | |||
| JP2004035847A | 2004-02-05 | |||
| JP2000249826A | 2000-09-14 | |||
| JP2004359843A | 2004-12-24 |
Attorney, Agent or Firm:
Axis International Patent Business Corporation