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Title:
MESH-LIKE RESIN MOLDING, STRUCTURE, AND METHOD FOR USING MESH-LIKE RESIN MOLDING
Document Type and Number:
Japanese Patent JP2016221966
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a mesh-like resin molding which facilitates wiring work without impairing rigidity and is excellent in a degree of freedom in design, a structure, and a method of using the same.SOLUTION: A mesh-like resin molding 10 comprises a plurality of first resin linear parts 11 extending in parallel to each other, and a plurality of second resin linear parts 12 extending in parallel to each other in a direction crossing the first resin linear parts 11. Each first resin linear part 11 and each second resin linear part 12 are joined together at a junction part 13 located at a mutually crossing part 14. When viewing the first resin linear part 11 and the second resin linear part 12 in an orthogonal projection direction P orthogonal to axial centers 11a, 12a of the first resin linear part 11 and the second resin linear part 12, a second area which is an area of the junction part 13 of the first resin linear part 11 and the second resin linear part 12 is smaller than a first area which is an overlapping area of the first resin linear part 11 and the second resin linear part 12.SELECTED DRAWING: Figure 1

Inventors:
FUSHIMI ATSUSHI
TOMIZAWA YUJI
IKEDA HIROKI
NAKAJIMA RYO
Application Number:
JP2016106547A
Publication Date:
December 28, 2016
Filing Date:
May 27, 2016
Export Citation:
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Assignee:
TOKYO PRINTING INK MFG CO LTD
International Classes:
B29D28/00; B29C48/345; B29C73/30; F16G13/16; H02G3/04
Domestic Patent References:
JPH0511720U1993-02-12
JP2010148335A2010-07-01
JPS5446972A1979-04-13
Foreign References:
WO2015002730A12015-01-08
Attorney, Agent or Firm:
Shinji Hayami