Title:
【発明の名称】半導体ウエハーの処理方法および装置
Document Type and Number:
Japanese Patent JP2939771
Kind Code:
B2
Inventors:
NASHIMOTO KYOSHI
Application Number:
JP10319591A
Publication Date:
August 25, 1999
Filing Date:
April 08, 1991
Export Citation:
Assignee:
ANERUBA KK
International Classes:
H01L21/66; G01J5/00; G01K7/00; G01K15/00; H01L21/205; H01L21/677; H01L21/68; (IPC1-7): H01L21/66; G01J5/00; G01K7/00; G01K15/00; H01L21/205; H01L21/68
Domestic Patent References:
| JP1268120A | ||||
| JP62118519A | ||||
| JP3165514A | ||||
| JP4226047A | ||||
| JP4183862A | ||||
| JP4871688A |
Attorney, Agent or Firm:
Suzuki Seiji