Title:
A dividing method of the wafer layered product for image sensors
Document Type and Number:
Japanese Patent JP6140030
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a cutting method of an image sensor wafer package which allows for clear cutting effectively by a simple dry technique, without using a dicing saw.SOLUTION: In a cutting method of a wafer laminate W for image sensor having a structure where a glass wafer 1 and a silicon wafer 2 are bonded via a resin layer 4 arranged to surround each photodiode forming region, a scribe line S consisting of a crack penetrating in the thickness direction is formed, by rolling a scribing wheel 10, while pressing, along a cutting line on the upper surface of the glass wafer. Subsequently, the wafer laminate is deflected by pressing a break bar 14 from the lower surface side of the silicon wafer along the scribe line, thus cutting the silicon wafer along with the glass wafer.
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Inventors:
Takehiro Uemura
Application Number:
JP2013170863A
Publication Date:
May 31, 2017
Filing Date:
August 21, 2013
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
H01L21/301; B28D5/00; H01L27/14
Domestic Patent References:
| JP2010232378A | ||||
| JP2013122984A | ||||
| JP2013012552A | ||||
| JP5090403A | ||||
| JP2009204780A |
Foreign References:
| WO2007004700A1 | ||||
| WO2001082542A1 |
Attorney, Agent or Firm:
Yoshio Kashima
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