PURPOSE: To avoid the deterioration in performances of a printed-wiring board due to side-etching step when said printed-wiring board in the conductor width not exceeding specific value is to be manufactured by etching step of one or both surface metallic foil laminated sheets.
CONSTITUTION: An etching resist pattern in the minimum conductor width not exceeding 180μm is formed by screen printing step to be etched away on a metallic foil surface of a metallic foil plated laminated sheets manufactured by impregnating a fablic base material with a thermosetting resin, also specific number of prepregs comprising resin in B shape are laminated and then metallic foils 9-28μm thick are laminated on one or both surfaces of the prepregs to be thermal-pressurized.
NAKAMURA YOSHIHIRO
NARABE YOSHIYUKI