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Patent Searching and Data


Title:
MANUFACTURE OF PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH0613730
Kind Code:
A
Abstract:

PURPOSE: To avoid the deterioration in performances of a printed-wiring board due to side-etching step when said printed-wiring board in the conductor width not exceeding specific value is to be manufactured by etching step of one or both surface metallic foil laminated sheets.

CONSTITUTION: An etching resist pattern in the minimum conductor width not exceeding 180μm is formed by screen printing step to be etched away on a metallic foil surface of a metallic foil plated laminated sheets manufactured by impregnating a fablic base material with a thermosetting resin, also specific number of prepregs comprising resin in B shape are laminated and then metallic foils 9-28μm thick are laminated on one or both surfaces of the prepregs to be thermal-pressurized.


Inventors:
IKEDA KENICHI
NAKAMURA YOSHIHIRO
NARABE YOSHIYUKI
Application Number:
JP16973792A
Publication Date:
January 21, 1994
Filing Date:
June 29, 1992
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H05K3/06; (IPC1-7): H05K3/06
Attorney, Agent or Firm:
Hirose Akira