Title:
基板の組立て方法、基板の組立て装置、液状物質の滴下方法及び液状物質の滴下装置
Document Type and Number:
Japanese Patent JP4113097
Kind Code:
B2
Inventors:
Shinichi Ogimoto
Application Number:
JP2003374557A
Publication Date:
July 02, 2008
Filing Date:
November 04, 2003
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
G02F1/1339; G09F9/00; G02F1/1341
Domestic Patent References:
| JP2002014360A | ||||
| JP6051256A | ||||
| JP2001264782A | ||||
| JP2001133799A | ||||
| JP11038424A |
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Sadao Muramatsu
Ryo Hashimoto