Title:
DUAL HEAT PUMP DEVICE
Document Type and Number:
Japanese Patent JP2018059648
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a dual heat pump device that can prevent liquid return to an air conditioning compressor by absorbing a surplus of an air conditioning refrigerant, and can improve reliability of equipment.SOLUTION: A dual heat pump device comprises: a first refrigerating circuit that connects a compressor, a condenser, first throttling means, and an evaporator with a pipe, and circulates a first refrigerant; a second refrigerating circuit that circulates a second refrigerant, and exchanges heat with the first refrigerant in the evaporator; and a heat medium circuit that circulates a heat medium, and exchanges heat with the first refrigerant in the condenser. A liquid receiver 19 and second throttling means 20 are sequentially connected to the second refrigerating circuit on the side of an outlet of the evaporator.SELECTED DRAWING: Figure 1
Inventors:
SHIGETA AKIHIRO
IIDAKA MASAYUKI
IIDAKA MASAYUKI
Application Number:
JP2016196135A
Publication Date:
April 12, 2018
Filing Date:
October 04, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
F25B7/00; F25B1/00; F25B29/00
Domestic Patent References:
| JP2004132647A | 2004-04-30 | |||
| JP2002081767A | 2002-03-22 |
Foreign References:
| WO2012128229A1 | 2012-09-27 |
Attorney, Agent or Firm:
Patent Business Corporation Kushibuchi International Patent Office