PURPOSE: To prevent the occurrence of such a fault as bending, etc., in legs of a molded package, to make the handling of the package easier, and improve the packing density of the package by eliminating the need of the legs which act as external lead sections for connection of the package.

CONSTITUTION: In the molded package of a semiconductor integrated circuit device, outside connection holes 3 are formed through the package main body 1 so as to expose part of lead electrodes 2 electrically connected with an IC chip 5 housed in the main body 1 and, when the electrodes 2 are connected with a printed board, etc., the projecting electrodes of the printed board are connected to the electrodes 2 through the holes 3.