土留め構造 - Obayashi Corporation

Title:

土留め構造

Document Type and Number:

Japanese Patent JP2024025089

Kind Code:

A

Abstract:

【課題】一方側の地盤を補強し易い土留め構造を提供する。【解決手段】一方側の地盤に設けられる第１土留め壁２と、他方側の地盤に設けられる第２土留め壁３と、第１土留め壁２に対して地山側に離隔して設けられる第３土留め壁４と、第１土留め壁２と第３土留め壁４の間に改良材によって少なくとも部分的に改良されることで形成される改良地盤５と、第１土留め壁２と第２土留め壁３の間に設けられる掘削部６と、を有する土留め構造１。【選択図】図１

More Like This:

WO/2024/039157	TEMPORARY EARTH-RETAINING STRUCTURE USING GUIDE BRACKET, AND CONSTRUCTION METHOD THEREFOR
JP3087021	INDUSTRIAL APPLICABILITY [Title of invention] Transport device for mountain retaining material, etc.
JP2794330	[Title of the Invention] A method for erection of a beam material that also serves as a cutting beam in an underground structure.

Inventors:

Toru Yamashita
Masato Takahashi
Kenji Fukuda

Application Number:

JP2022128240A

Publication Date:

February 26, 2024

Filing Date:

August 10, 2022

Export Citation:

Click for automatic bibliography generation Help

Assignee:

Obayashi Corporation

International Classes:

E02D17/04; E02D5/20

Attorney, Agent or Firm:

Kenji Sugimura
Mitsutsugu Sugimura
Kenichiro Kataoka

Previous Patent: Method for forming insulating film and method for manufacturing electronic device

Next Patent: Adhesive film for circuit connection, circuit connection structure and manufacturing method thereof