Title:
弾性波装置
Document Type and Number:
Japanese Patent JP7380703
Kind Code:
B2
Abstract:
An acoustic wave device includes a support substrate, a piezoelectric layer on the support substrate, and an IDT electrode on the piezoelectric layer and including a plurality of electrode fingers. The support substrate is a silicon carbide substrate including a 3C-SiC cubic crystal structure. The piezoelectric layer is a lithium tantalate layer or a lithium niobate layer. An SH wave is used as a main mode.
Inventors:
Hideki Iwamoto
Application Number:
JP2021554959A
Publication Date:
November 15, 2023
Filing Date:
November 05, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H03H9/25
Domestic Patent References:
| JP2019146143A | ||||
| JP8310900A | ||||
| JP2019114986A | ||||
| JP2007228225A | ||||
| JP2007182335A |
Foreign References:
| WO2013061926A1 | ||||
| WO2011046117A1 | ||||
| KR20100082541A |
Attorney, Agent or Firm:
Patent Attorney Osaka Front Patent Office
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