Title:
CAPACITANCE TYPE TRANSDUCER AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2018019339
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To simply perform a step of thinning a substrate thickness for suppressing reflection of ultrasonic waves by the substrate in a manufacturing method of a CMUT while suppressing a change of stress characteristics, etc. of a vibrating film.SOLUTION: The method of manufacturing a CMUT includes steps of: forming a support by raising a height in a stacking direction of a region outside a region where a gap is provided than a height in the stacking direction of the region where the gap is provided; and thinning a substrate thickness in the stacking direction by using the support.SELECTED DRAWING: Figure 2
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Inventors:
SETOMOTO YUTAKA
Application Number:
JP2016150107A
Publication Date:
February 01, 2018
Filing Date:
July 29, 2016
Export Citation:
Assignee:
CANON KK
International Classes:
H04R31/00; B81B3/00; B81C1/00; H04R19/00
Attorney, Agent or Firm:
Takuma Abe
Sogo Kuroiwa
Sogo Kuroiwa
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