Title:
高回路密度を有する電気スリップリング
Document Type and Number:
Japanese Patent JP4601110
Kind Code:
B2
Abstract:
Disclosed is a method of manufacturing a slip ring printed circuit board which includes forming a plurality of concentric spaced electrical contacts on one side of a non-conductive base and forming interconnecting electrical paths on an opposite side of the non-conductive base. The method of manufacturing a slip ring printed circuit board also includes electrically connecting the electrical contacts and the interconnecting electrical paths, depositing copper on the electrical contacts to form electrical rings and etching a groove into each of the electrical rings.
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| JP6769761 | Slip ring, and slip ring device with slip ring |
Inventors:
Barry Kent Witherspoon
Larry Dean Vought
Larry Dean Vought
Application Number:
JP2000025847A
Publication Date:
December 22, 2010
Filing Date:
February 03, 2000
Export Citation:
Assignee:
Moog Components Group, Inc.
International Classes:
H01R39/08; H01R43/10; H05K3/40; H01R39/10; H05K1/11; H05K3/10
Domestic Patent References:
| JP8236238A | ||||
| JP2005023A | ||||
| JP54091781A | ||||
| JP2000077829A | ||||
| JP11330658A | ||||
| JP9321397A | ||||
| JP5174930A | ||||
| JP62094594U | ||||
| JP57143881U |
Attorney, Agent or Firm:
Masumi Hosoda