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Patent Searching and Data


Title:
The electric conduction board for spot welding
Document Type and Number:
Japanese Patent JP6205141
Kind Code:
B2
Abstract:
The invention relates to a current-conducting plate used for spot welding, and the current-conducting plate can reduce reactive branch which directly flows to a negative electrode from a positive electrode through the internal of the current-conducting plate. In the current-conducting plate, a welded plate portion (20) formed by single-layer welding is provided with a first welded plate portion (21) crimped with the positive electrode, a second welded plate portion (22) crimped with the negative electrode, a gap (25) separating the two welded plate portions, and a connecting portion (23) connecting the first welded plate portion and the second welded plate portion which are separated by the gap. The gap is provided with a main gap portion (26) formed along the intersected direction of lines (L) of electrode crimping positions (21a,22a) of the first welded plate portion and the second welded plate portion, and an auxiliary gap portion (27) which is continuous from the end of the main gap portion, and detours and extends to the side of the electrode crimping position of at least a welded plate portion in the first welded plate portion and the second welded plate portion.

Inventors:
Hiroki Mukasa
Taishi Sakai
Application Number:
JP2013041088A
Publication Date:
September 27, 2017
Filing Date:
March 01, 2013
Export Citation:
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Assignee:
Yazaki Corporation
International Classes:
H01B5/02; B23K11/11
Domestic Patent References:
JP2011253641A
JP60096771U
JP2014056808A
Foreign References:
US20110274963
Attorney, Agent or Firm:
Patent business corporation glory patent office
Hironori Honda
Kiharu Masaharu