Title:
CONDUCTIVE PATTERN FORMATION SUBSTRATE, AND SUBSTRATE PRODUCTION METHOD
Document Type and Number:
Japanese Patent JP2017004788
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive pattern formation substrate in which a conductive pattern is further high-defined, and further, damage to a conductive pattern and a transparent substrate is suppressed.SOLUTION: In a conductive pattern formation substrate 1 provided with a transparent substrate 101, a transparent conductive layer 102 and a conductive pattern 110, the conductive pattern 110 includes: a patterned transparent conductive layer 111 formed on the surface of the transparent substrate 101 into a prescribed pattern continuously to the transparent conductive layer 102; and a patterned metal layer 112 formed of a conductive material essentially consisting of metal grains on the surface of the patterned transparent conductive layer 111.SELECTED DRAWING: Figure 2
Inventors:
KUDO YUZURU
ENDO HIROYUKI
ENDO HIROYUKI
Application Number:
JP2015118177A
Publication Date:
January 05, 2017
Filing Date:
June 11, 2015
Export Citation:
Assignee:
RICOH CO LTD
International Classes:
H01B5/14; G06F3/041; H01B13/00; H05K3/00; H05K3/08
Attorney, Agent or Firm:
Hideo Takino