Title:
電気素子
Document Type and Number:
Japanese Patent JP6374718
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve the problem in which when a copper alloy is used for an electric contact for connector as it is, a surface oxidizes and increases in electric resistivity to cause a decrease in reliability of a product, to solve the problem in which although a noble metal plating layer is therefore formed on the surface of the Cu alloy to prevent the surface oxidation, use of the noble metal plating layer raises the cost, and to further improve wear resistance, corrosion resistance, heat resistance, etc.SOLUTION: The problem is solved by an electric contact for connector formed by providing an oxide thin film 16 doped with an element on a base material 12.SELECTED DRAWING: Figure 1
Inventors:
Kenzo Tanaka
Yoshitaka Ito
Takaya Kondo
Yoshitaka Ito
Takaya Kondo
Application Number:
JP2014144249A
Publication Date:
August 15, 2018
Filing Date:
July 14, 2014
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
C23C28/00; B32B9/00; C23C18/12; C25D7/00; H01H1/04; H01R13/03
Domestic Patent References:
| JP2247388A | ||||
| JP2003528980A | ||||
| JP2010232681A | ||||
| JP2012113968A | ||||
| JP2013222659A | ||||
| JP2005512302A | ||||
| JP2013221166A | ||||
| JP2009084616A | ||||
| JP2006500759A | ||||
| JP2005048201A | ||||
| JP2012237055A | ||||
| JP2011003780A |
Attorney, Agent or Firm:
Patent business corporation glory patent office
Hironori Honda
Kenji Kitajima
Tatsuya Hanasaka
Hironori Honda
Kenji Kitajima
Tatsuya Hanasaka