Title:
電気機械トランスデューサデバイスおよびその製造方法
Document Type and Number:
Japanese Patent JP5512694
Kind Code:
B2
Abstract:
A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure comprising at least one mechanical layer having a first thermal response characteristic and a first mechanical stress response characteristic, at least one layer of the actuating structure, the at least one layer having a second thermal response characteristic different to the first thermal response characteristic and a second mechanical stress response characteristic different to the first mechanical stress response characteristic, a first compensation layer having a third thermal response characteristic and a third mechanical stress characteristic, and a second compensation layer having a fourth thermal response characteristic and a fourth mechanical stress response characteristic. The first and second compensation layers are arranged to compensate a thermal effect produced by the different first and second thermal response characteristics of the mechanical structure and the at least one layer of the actuating structure such that movement of the movable structure is substantially independent of variations in temperature and to adjust a stress effect produced by the different first and second stress response characteristics of the mechanical structure and the at least one layer of the actuating structure such that the movable structure is deflected a predetermined amount relative to the substrate when the electromechanical transducer device is in an inactive state.
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Inventors:
Perucho, Francois
Defy, Emmanuel
Ray, Patrice
Liu, Liang Jun
Pacheco, Sergio
Defy, Emmanuel
Ray, Patrice
Liu, Liang Jun
Pacheco, Sergio
Application Number:
JP2011537008A
Publication Date:
June 04, 2014
Filing Date:
November 25, 2009
Export Citation:
Assignee:
Freescale Semiconductor, Inc.
International Classes:
H01H57/00; B81B3/00; B81C1/00; H02N2/00
Domestic Patent References:
| JP6283083A | ||||
| JP2002237245A | ||||
| JP2003208841A | ||||
| JP2004261884A |
Attorney, Agent or Firm:
Atsushi Honda