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Title:
電気絶縁性樹脂組成物、及びこれを用いた回路基板用積層体
Document Type and Number:
Japanese Patent JP4689317
Kind Code:
B2
Abstract:

To provide a resin composition with electrical insulation, forming an electrical insulation layer which has excellent flexibility and adhesion to a substrate together with a high resistance to heat and moisture, can be treated at a high temperature in soldering and is stably usable for a long period of time even under the severity conditions of a high temperature and a high humidity such as in an engine room of an automobile.

The resin composition contains (I) a rubbery polymer compound composed of a copolymer of diene monomers, (II) a polymerizable monomer having at least one double bond at the ends, (III) a crosslinking agent and (IV) a thermal conductive inorganic filler, and also optionally contains (V) an unsaturated cyclic oligomer. The electrical insulation layer having excellent flexibility, adhesion, moisture resistance and resistance to thermal deterioration, can be formed from the resin composition.

COPYRIGHT: (C)2007,JPO&INPIT


Inventors:
Tomoyuki Ito
Nobuaki Koyama
Koichi Kusagawa
Application Number:
JP2005092923A
Publication Date:
May 25, 2011
Filing Date:
March 28, 2005
Export Citation:
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Assignee:
Nippon Jojo Co., Ltd.
International Classes:
C08L51/04; B32B15/08; B32B15/085; B32B25/16; B32B25/18; C08F255/00; C08K3/00; C08K5/14; C08K5/23; H05K1/03
Domestic Patent References:
JP2004196876A
JP8208856A
Foreign References:
WO2004039873A1
Attorney, Agent or Firm:
Hiroaki Sakai