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Title:
A photosensitive resin composition, a photosensitive resin paste comprising the photosensitive resin composition, a cured film obtained by curing them, and an electrode circuit having the same.
Document Type and Number:
Japanese Patent JP6349844
Kind Code:
B2
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Inventors:
Takayuki Muroi
Hideki Shinohara
Application Number:
JP2014063388A
Publication Date:
July 04, 2018
Filing Date:
March 26, 2014
Export Citation:
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Assignee:
TORAY INDUSTRIES,INC.
International Classes:
G03F7/004; G03F7/038; H05K3/12
Domestic Patent References:
JP2005298661A
JP2000305260A
JP2000090738A
JP2013137511A
JP2005235760A
JP2009295895A
JP2010020046A
Foreign References:
WO2012124438A1
WO2011114846A1
US20050170284
WO2011152404A1



 
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