Title:
電極接合装置および電極接合方法
Document Type and Number:
Japanese Patent JP6444311
Kind Code:
B2
Abstract:
The present invention has an object to provide an electrode bonding apparatus that performs ultrasonic vibration bonding on points of an electrode and is capable of reducing variations in a peel force among the points even when the electrode is bonded onto the substrate at a lower peel force. According to the present invention, a collecting electrode (20A, 20B) is disposed along a side (L1, L2) of a glass substrate (1) on a solar cell (ST1). Then, the glass substrate is pressed along the side in a region of the glass substrate between the side and an arrangement position of the collecting electrode. During application of the pressure, the ultrasonic vibration bonding is performed on the collecting electrode using an ultrasonic vibration tool (14).
Inventors:
Akihiro Ichinose
Yoshito Yamada
Hiroyuki Nishinaka
Akio Yoshida
Yoshito Yamada
Hiroyuki Nishinaka
Akio Yoshida
Application Number:
JP2015546188A
Publication Date:
December 26, 2018
Filing Date:
November 06, 2013
Export Citation:
Assignee:
Toshiba Mitsubishi Electric Industrial Systems Co., Ltd.
International Classes:
H01L31/0224; B23K20/10
Domestic Patent References:
| JP20115500A | ||||
| JP2005183459A |
Foreign References:
| US20110308545 | ||||
| US20130139885 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita