Title:
An electrolytic copper foil, the electric parts containing this, and a battery
Document Type and Number:
Japanese Patent JP6014186
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide: low-roughness electrolytic copper foil that allows high elongation in spite of thin thickness and high mechanical strength; and an electrical component and a battery that comprise the electrolytic copper foil.SOLUTION: An electrolytic copper foil is presented in which the average diameter of pores is from 1 nm to 100 nm, the pores being regions between protruding surface elements on a deposition face. The electrolytic copper foil exhibits a high elongation percentage while maintaining low roughness and high strength, and can be used in, e.g., a semiconductor packaging substrate for tape automated bonding (TAB) used in a tape carrier package (TCP) and a collector of a medium to large scale lithium ion secondary battery.SELECTED DRAWING: Figure 5
Inventors:
Lee, Song Hyun
Cho, Techin
Park, Solki
Son, Kidoku
Cho, Techin
Park, Solki
Son, Kidoku
Application Number:
JP2015041704A
Publication Date:
October 25, 2016
Filing Date:
March 03, 2015
Export Citation:
Assignee:
ILJIN MATERIALS CO., LTD.
International Classes:
C25D1/04; C25D1/00; H01M4/66
Domestic Patent References:
| JP2007146289A | ||||
| JP2015061937A | ||||
| JP2014135175A |
Foreign References:
| WO2014073696A1 |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office