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Patent Searching and Data


Title:
An electrolytic copper foil and a manufacturing method for the same
Document Type and Number:
Japanese Patent JP6039540
Kind Code:
B2
Abstract:
There is provided a high gloss electrodeposited copper foil which can be manufactured in a short time. The electrodeposited copper foil has a fraction of the areas occupied by the {100} plane deviating by 18° or less from the <001> crystal orientation of 10% or more determined by analysis of the surface by electron backscatter diffraction (EBSD) and at least one surface of the electrodeposited copper foil has a glossiness Gs (20°) of 1,500 or more, determined in accordance with JIS Z 8741-1997.

Inventors:
Matsuura Yoshinori
Toshimi Nakamura
Naei politics
Watanabe Hajime
Application Number:
JP2013258566A
Publication Date:
December 07, 2016
Filing Date:
December 13, 2013
Export Citation:
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Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C25D1/04; H01B5/02; H01L51/50; H05B33/26
Domestic Patent References:
JP2005076091A
JP2009020920A
JP2009231309A
JP2009185384A
Foreign References:
WO2013002275A1
WO2011152092A1
WO2006106956A1
Attorney, Agent or Firm:
Masaharu Takamura
Hiroki Kashima