Title:
The electromagnetic shielding material for FPC
Document Type and Number:
Japanese Patent JP6081819
Kind Code:
B2
Abstract:
The present invention provides an electromagnetic wave shielding material for an FPC which has excellent adherence strength among a substrate, a conductive paste layer, and a conductive adhesive layer, has no partial delamination on an adhesive interlayer between the substrate and the conductive paste layer even if a bending operation is repeated, and suppresses sequential deterioration of the electromagnetic shielding performance. To this end, the electromagnetic wave shielding material for an FPC is formed by sequentially stacking a substrate (1) composed of a thin film resin film of a coated dielectric, an anchor coat layer (2), a conductive paste layer (3), and a conductive adhesive layer (4) on one surface of a support film (6). A component capable of being cured by penetrating into the anchor coat layer (2) and/or the conductive paste layer (3) is included in a part of the conductive adhesive layer (4). The conductive adhesive layer (4) preferably includes an epoxy resin having a number-average molecular weight of 1500 or smaller.
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Inventors:
Naohiro Nomura
Sanae Fujii
Sakuragi Takanori
Sanae Fujii
Sakuragi Takanori
Application Number:
JP2013038698A
Publication Date:
February 15, 2017
Filing Date:
February 28, 2013
Export Citation:
Assignee:
Fujimori Industry Co., Ltd.
International Classes:
H05K9/00; B32B27/00; H04M1/02
Domestic Patent References:
| JP2012231021A | ||||
| JP2011116950A | ||||
| JP2000129011A |
Foreign References:
| WO2012105220A1 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Takashi Watanabe