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Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0649300
Kind Code:
A
Abstract:

PURPOSE: To obtain a thermoplastic resin composition which comprises a styrene resin bearing groups reactive with epoxy and a modified olefinic polymer bearing amide and glycidyl groups, thus gives moldings of high delamination resistance and has excellent flowability and converability.

CONSTITUTION: (A) 5 to 98 pts.wt. of a styrene resin bearing functional groups reactive with epoxy, containing vinyl cyanide and/or alkyl methacrylate as copolymer components, and having a reduced viscosity of 0.2 to 1.2dl/g (in methylformamide solution, 30°C, 0.3g/dl concentration) in the fraction soluble in methyl ethyl ketone are compounded with (B) 95 to 2 pts.wt. of a modified olefinic polymer which is modified with a compound of the formula (Ar is a 6 to 23C aromatic hydrocarbon having at least one of reactive groups of glycidyl or glycidyloxy; R is H, methyl) and has an amide group and a reactive group, such as glycidyloxy and glycidyl per 2 to 1,000 olefin units to give the objective composition.


Inventors:
MISHIMA YASUHIRO
WADA KAZUHITO
Application Number:
JP22464792A
Publication Date:
February 22, 1994
Filing Date:
July 30, 1992
Export Citation:
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Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C08G81/00; C08G81/02; C08L23/00; C08L23/08; C08L23/26; C08L25/08; C08L51/06; (IPC1-7): C08L23/26; C08G81/00; C08L25/08
Attorney, Agent or Firm:
Kenji Itami



 
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