Title:
低周波用アンテナパターンが埋め込まれる電子装置ケース、その製造金型及び製造方法
Document Type and Number:
Japanese Patent JP5305113
Kind Code:
B2
Abstract:
There is provided an electronic device case having a low frequency antenna pattern embedded therein, the case including: a radiator frame injection molded using a polymer mixture containing a magnetic substance component so that a radiator including a low frequency antenna pattern part is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.
Inventors:
Sungs, Jaesque
Hong, Haryong
Chang, Ki Won
Moon, Hyun Sam
Lee, Daekyu
Lee, Byung Hwa
Kim, Tae Sung
Rim, Daeki
Na, yong seek
Lee, Duk Wu
Hong, Haryong
Chang, Ki Won
Moon, Hyun Sam
Lee, Daekyu
Lee, Byung Hwa
Kim, Tae Sung
Rim, Daeki
Na, yong seek
Lee, Duk Wu
Application Number:
JP2011083561A
Publication Date:
October 02, 2013
Filing Date:
April 05, 2011
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
H01Q1/40; B29C33/14; B29C45/14; H01P11/00; H01Q7/06
Domestic Patent References:
| JP2009022001A | ||||
| JP2007116347A | ||||
| JP8276458A | ||||
| JP2009021932A | ||||
| JP2005333244A | ||||
| JP2005277607A | ||||
| JP6253910A | ||||
| JP2008072721A | ||||
| JP2010259038A | ||||
| JP2010259043A |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation