Title:
Electronic and cooling devices
Document Type and Number:
Japanese Patent JP6308207
Kind Code:
B2
Abstract:
An electronic board 200 has a heat generating component 220 mounted on it. An enclosure 300 houses the electronic board 200. A heat transport unit 400 is coupled to the enclosure 300 and transports heat generated by the heat generating component 220 to the outside. A heat receiving unit 510 is provided in a heat transport unit 400, 400A. The heat receiving unit 510 receives heat generated by the heat generating component 220. A heat dissipating unit 530 is provided in the heat transport unit 400 in such a manner that a portion of the heat dissipating unit 530 is exposed to outside air, and is coupled to the heat receiving unit 510. The heat dissipating unit 530 dissipates heat received by the heat receiving unit 510 to the outside. A guide duct unit 340 is formed into a tube interconnecting the heat generating component 220 and the heat receiving unit 510 in order to release heat of the heat generating component 220 to the heat receiving unit 510. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.
Inventors:
Hitoshi Sakamoto
Minoru Yoshikawa
Alley Akatsuki
Masaki Chiba
Kenichi Inaba
Matsunaga Yuji
Minoru Yoshikawa
Alley Akatsuki
Masaki Chiba
Kenichi Inaba
Matsunaga Yuji
Application Number:
JP2015502751A
Publication Date:
April 11, 2018
Filing Date:
February 19, 2014
Export Citation:
Assignee:
NEC
International Classes:
H05K7/20
Domestic Patent References:
| JP2002158475A | ||||
| JP2011114051A | ||||
| JP2004158641A | ||||
| JP2010160533A |
Attorney, Agent or Firm:
Masahiko Desk
Naoki Shimosaka
Naoki Shimosaka