Title:
ELECTRONIC DEVICE AND MANUFACTURING METHOD FOR THE SAME
Document Type and Number:
Japanese Patent JP2018078243
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To obtain a highly reliable joint stably, even if nonuniformity of gaps between wiring boards occurs, when the wiring boards are joined directly by a conductive joint material.SOLUTION: An electronic device includes a wiring board 10 having an insulating substrate 11, and lands 12 provided on a principal surface 11a of the insulating substrate 11, a wiring board 20 having an insulating substrate 21 and lands 22 provided on a principal surface 21a of the insulating substrate 21, and being arranged so that the principal surface 21a faces the principal surface 11a, and a conductive connection 30 for electrically connecting the lands 12 and lands 22. The conductive connection 30 has a conductive part 31 being formed on the lands 12 and containing a conductive joint material, a conductive part 32 being formed on the lands 22 and containing the conductive joint material, and a conductive partition member 33 being interposed between the conductive part 31 and the conductive part 32 and partitioning the conductive part 31 and the conductive part 32.SELECTED DRAWING: Figure 3
Inventors:
HASEGAWA MASAAKI
Application Number:
JP2016220721A
Publication Date:
May 17, 2018
Filing Date:
November 11, 2016
Export Citation:
Assignee:
SHINDENGEN ELECTRIC MFG
International Classes:
H05K1/14; H05K3/36
Attorney, Agent or Firm:
Tomoya Deguchi
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Masashi Yoshida
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Masashi Yoshida