Title:
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2019080155
Kind Code:
A
Abstract:
To provide an electronic device and a manufacturing method thereof that can miniaturize an electronic component and can easily manufacture a connection structure between an external terminal and electrodes of the electronic component.SOLUTION: A plurality of electronic device formation regions for forming a plurality of electronic devices are formed on a first substrate 8 made of a silicon substrate, and a scheduled cutting region 16 to be cut and removed at the time of singulation is formed between the adjacent electronic device formation regions. A transducer 2 and an integrated circuit 3 are mounted on the surface of the first substrate 8 as electronic components, and electrodes connected to the electronic components are formed. The transducer 2 is disposed on a hole 5 through which sound pressure and the like propagate from the outside.SELECTED DRAWING: Figure 1
Inventors:
ARAKI SHINICHI
Application Number:
JP2017205359A
Publication Date:
May 23, 2019
Filing Date:
October 24, 2017
Export Citation:
Assignee:
NEW JAPAN RADIO CO LTD
International Classes:
H04R19/04; H01L25/00; H04R1/04; H04R31/00
Domestic Patent References:
| JP2007043017A | 2007-02-15 |