絶縁膜形成用インキ組成物、該インキ組成物から形成された絶縁膜、該絶縁膜を有する電子素子

Title:

絶縁膜形成用インキ組成物、該インキ組成物から形成された絶縁膜、該絶縁膜を有する電子素子

Document Type and Number:

Japanese Patent JP5403314

Kind Code:

B2

Abstract:

To first provide an ink composition with insulating properties for forming an insulating film which can be burnt at a low temperature and has solvent resistance and insulating properties; to second provide a film with insulating properties formed with the ink composition; and, in addition, to third provide an electronic device in which the insulating film is placed on a flexible substrate using the ink composition.

First, the ink composition for forming the insulating film containing an organic solvent, a solid polyfunctional modified epoxy resin and a crosslinking agent as essential ingredients is provided. Particularly, the ink composition for forming the insulating film containing the solid polyfunctional modified epoxy resin of 70% or more with respect to the total solid component in the ink composition. Second, the insulating film formed with the ink composition for forming the insulating film is provided, and, third, an organic transistor device including the insulating film as a constitutive member as a gate insulating film is provided.

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Inventors:

餌取 Hideki
Toshihiro Ebine
50 住宏
Masanori Kasai

Application Number:

JP2008104523A

Publication Date:

January 29, 2014

Filing Date:

April 14, 2008

Export Citation:

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Assignee:

DIC, Inc.

International Classes:

C09D11/10; C09D11/033; C09D11/037; C09D11/103; H01L21/28; H01L21/283; H01L21/312; H01L21/768; H01L29/786; H01L51/05; H01L51/30

Attorney, Agent or Firm:

Michihiro Kono

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