Title:
ELECTRONIC DEVICE, LIQUID JET HEAD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2017042953
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an electronic device which inhibits an adhesive from wetting and spreading to contribute to downsizing, and to provide a liquid jet head and a manufacturing method of the electronic device.SOLUTION: An electronic device includes: an actuator substrate 13 having a bump electrode 40 which is a structure protruding from one surface; and a sealing plate 33 which faces a surface of the actuator substrate, on which the bump electrode is formed, and is disposed laminated on the actuator substrate through a spacer 43. The actuator substrate and the spacer are adhered by an adhesive 49. The adhesive extends along the one surface of the actuator substrate to the bump electrode.SELECTED DRAWING: Figure 3
Inventors:
NANBA TOSHISHIGE
SAITO TOMOYOSHI
TANAKA SHUICHI
SAITO TOMOYOSHI
TANAKA SHUICHI
Application Number:
JP2015165507A
Publication Date:
March 02, 2017
Filing Date:
August 25, 2015
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B41J2/14; B41J2/16
Domestic Patent References:
| JP2015089614A | 2015-05-11 | |||
| JP2004358796A | 2004-12-24 | |||
| JP2009226796A | 2009-10-08 | |||
| JP2007180166A | 2007-07-12 | |||
| JP2008300838A | 2008-12-11 | |||
| JP2016175274A | 2016-10-06 |
Foreign References:
| US20080297006A1 | 2008-12-04 |
Attorney, Agent or Firm:
Kazuaki Watanabe
Keisuke Nishida
Satoshi Nakai
Keisuke Nishida
Satoshi Nakai