Title:
An electronic equipment unit and its manufacture metallic mold device
Document Type and Number:
Japanese Patent JP6016965
Kind Code:
B2
Abstract:
An electronic equipment unit includes a multi-layer circuit board. A part arrangement region on which circuit parts are mounted and a terminal region are provided on the multi-layer circuit board. The part arrangement region is encapsulated with resin. An outline region is formed from a solder resist film surrounding the part arrangement region to prevent the resin from flowing into the terminal region. A non-solder resist region is provided so as to surround the outline region and formation of the solder resist film is inhibited in the non-solder resist region. A clamp abutting surface which is pressed by a mold and surrounds the terminal region and thereby prevents the resin from flowing into the terminal region is a partial region of the multi-layer circuit board where a surface layer circuit pattern is absent.
Inventors:
God Saki Shozo
Fumimitsu Arima
Hiroyoshi Nishizaki
Nakanishi Masato
Fumimitsu Arima
Hiroyoshi Nishizaki
Nakanishi Masato
Application Number:
JP2015039807A
Publication Date:
October 26, 2016
Filing Date:
March 02, 2015
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L23/12; H01L23/28; H05K3/28; H05K3/46
Domestic Patent References:
| JP2008112929A | ||||
| JP2001344587A | ||||
| JP858275A |
Attorney, Agent or Firm:
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa