Title:
ELECTRONIC COMPONENT MOUNTING MODULE AND FORMATION METHOD THEREOF
Document Type and Number:
Japanese Patent JP2019169594
Kind Code:
A
Abstract:
To provide an electronic component mounting module, or the like using bus bars which improves heat dissipation characteristics, impact characteristics, or the like by increasing contact area of a bus bar laminate and a mold resin, and more preferably making flow solder usable by arranging the height of a solder mounting surface of the laminated bus bar of the positive electrode and the bus bar of the negative electrode.SOLUTION: In an electronic component mounting module including an electronic component where a pair of lead terminals are soldered to insulation laminated first and second bus bars, the first bus bar is formed into a convex body projecting to the second bus bar side, in the vicinity of a soldering insertion hole for second lead terminal, and at least the first lead terminal and the first bus bar or the second bus bar are fixed with resin, or the second lead terminal and the first bus bar or the second bus bar are fixed with resin.SELECTED DRAWING: Figure 1
Inventors:
ICHIKURA OSAMU
KUROSU MITSURU
ABE TSUBASA
TAMAI HIRONARI
YAMATANI KOJI
KUROSU MITSURU
ABE TSUBASA
TAMAI HIRONARI
YAMATANI KOJI
Application Number:
JP2018055779A
Publication Date:
October 03, 2019
Filing Date:
March 23, 2018
Export Citation:
Assignee:
NIPPON CHEMICON
International Classes:
H01G4/228; H01G2/08; H01L25/07; H01L25/18
Domestic Patent References:
| JP2005176555A | 2005-06-30 | |||
| JP2010258343A | 2010-11-11 | |||
| JPS55164872U | 1980-11-27 | |||
| JPH0626117U | 1994-04-08 |
Attorney, Agent or Firm:
Kazuhiro Kamata