Title:
The electronic parts or optical goods containing the manufacturing method of a photosensitive resin composition, its relief pattern film, and a relief pattern film, and a relief pattern film, and the adhesives containing a photosensitive resin composition
Document Type and Number:
Japanese Patent JP6138943
Kind Code:
B2
Abstract:
The objective of the present invention is to obtain a photosensitive resin composition which does not have the defects of conventional technology and which is capable of forming an accurate polyimide pattern easily by a low-temperature process. A photosensitive resin composition is obtained which is characterized by comprising (A) a polymeric precursor having repeating units of a polyamic acid or a polyamic acid ester in at least a portion thereof, and (B) a nonionic photoreactive latent basic substance which generates strongly basic tertiary amine upon irradiation of active light.
Inventors:
Taishi Yang
Takao Miwa
Takao Miwa
Application Number:
JP2015530770A
Publication Date:
May 31, 2017
Filing Date:
July 15, 2014
Export Citation:
Assignee:
Taiyo Holdings Co., Ltd.
International Classes:
C08L79/08; C08K5/34; C09D5/25; C09D7/12; C09D179/08; C09J11/06; C09J179/08; G03F7/004; G03F7/038
Domestic Patent References:
| JP2003140352A | ||||
| JP2006045423A | ||||
| JP2010186055A | ||||
| JP2001512421A | ||||
| JP2009265294A | ||||
| JP2009244745A |
Foreign References:
| WO2014104090A1 | ||||
| WO2009028208A1 |
Other References:
Katsuyuki Okeya, Tsuyoshi Takagi,The Width-w NAF Method Provides Small memory and Fast Elliptic Scalar Multiplications Secure against,Topics in Cryptology - CT-RSA 2003,米国,Springer,2003年 4月13日,RSA Conference 2003,pages.328-343
Attorney, Agent or Firm:
Satoshi Eto