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Patent Searching and Data


Title:
An endoscope provided with an imaging device and the imaging device
Document Type and Number:
Japanese Patent JP6146976
Kind Code:
B2
Abstract:
An image pickup apparatus includes a substrate 2, on a first surface 2i of which a light receiving section 3 and a peripheral circuit section 4 are formed, a multilayer wiring layer 7 stacked on the first surface 2i and including a plurality of metal layers 6 and insulating layers 5, a translucent cover 10 located on the multilayer wiring layer 7, and a side surface sealing member 10z extending from a peripheral section of a surface 10t in the translucent cover 10 to the substrate 2 side while having a frame shape, an extending end 10ze of the side surface sealing member 10z being water-tightly set in contact with a non-formation region 2v of the multilayer wiring layer 7 on the first surface 2i of the substrate 2 to thereby protect outer peripheral side surfaces 5g of the multilayer wiring layer 7.

Inventors:
Ikari Arashi
Noriyuki Fujimori
Application Number:
JP2012209817A
Publication Date:
June 14, 2017
Filing Date:
September 24, 2012
Export Citation:
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Assignee:
Olympus Endo Technology America Inc.
International Classes:
H01L27/14; A61B1/04; H01L21/3205; H01L21/768; H01L23/12; H01L23/522; H04N5/335
Domestic Patent References:
JP2007335830A
JP2009206496A
JP2012015470A
JP2008526022A
JP2009064839A
JP2010098066A
JP2007288024A
JP2009206253A
Foreign References:
US20080191334
WO2008023827A1
Attorney, Agent or Firm:
Susumu Ito
Yasushi Hasegawa
Osamu Shinoura