封筒 - Ogino Mitsusha Co., Ltd.

Title:

封筒

Document Type and Number:

Japanese Patent JP5073199

Kind Code:

B2

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Inventors:

Yoshiaki Ogino
Fumihiko Ogino
Takao Ogino

Application Number:

JP2005348459A

Publication Date:

November 14, 2012

Filing Date:

December 01, 2005

Export Citation:

Assignee:

Ogino Mitsusha Co., Ltd.

International Classes:

B65D27/00; B65D27/04

Domestic Patent References:

Attorney, Agent or Firm:

Shunichi Shuto

Previous Patent: JPS5073198

Next Patent: JPS5073200