エポキシ接着剤組成物

Japanese Patent JP7431579

B2

The present invention provides an epoxy adhesive composition capable of reducing re-aggregation of an adhesive layer modifier, maintaining favorable viscosity for a long period of time, exhibiting high adhesiveness, and reducing process failures during application of the adhesive. Provided is an epoxy adhesive composition containing: a modified polyvinyl acetal resin having a constitutional unit with an acid-modified group; an adhesive layer modifier; and an epoxy resin, the epoxy adhesive composition having a ratio of an acid-modified group equivalent of the modified polyvinyl acetal resin to an epoxy equivalent of the epoxy resin (acid-modified group equivalent/epoxy equivalent) of 5.0 to 150.0, the epoxy adhesive composition having a number ratio of the acid-modified group to an epoxy group (acid-modified group number/epoxy group number) of 0.0005 to 0.5.

JP2007059505	SURFACE-MOUNTED LED PACKAGE
JPH03255185	ADHESIVE FOR PRINTED WIRING BOARD MADE BY THE ADDITIVE PROCESS
JPH101657	LOW TEMPERATURE-CURING TYPE ADHESIVE RESIN COMPOSITION AND LOW TEMPERATURE-CURING TYPE ADHESIVE SHEET FORMED BY USING THE SAME

Yu Yamada
Shiori Tateno
Yosuke Chiba
Takayuki Maeda
Yukio Ochiya
Hideaki Tanaka

JP2019516720A

February 15, 2024

March 11, 2019

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Sekisui Chemical Co.,Ltd.

C09J163/00; C09J11/04; C09J129/14

JP2011051247A
JP2006159900A
JP2017035843A
JP2000212532A
JP2002285118A
JP11005828A
JP2000218734A
JP2013110084A
JP2006290997A
JP2003198141A
JP2008130592A
JP2012250543A
JP2009119855A
JP2005302997A

WO2001031985A1

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