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Title:
EPOXY GROUP-CONTAINING VINYL COPOLYMER, THERMOPLASTIC RESIN COMPOSITION, AND MOLDED ARTICLE OF THE SAME
Document Type and Number:
Japanese Patent JP2017149809
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy group-containing vinyl copolymer capable of enhancing compatibility between a styrenic resin and a polyester resin, and to provide a thermoplastic resin composition which is excellent in flowability, can enhance impact resistance and surface glossiness of a molded article, and contains a styrenic resin and a polyester resin.SOLUTION: There is provided an epoxy group-containing vinyl copolymer which is a copolymer of a vinyl monomer (a) that contains at least 55-88 wt.% of an aromatic vinyl monomer (a1), 10-35 wt.% of a vinyl cyanide monomer (a2) and 2-25 wt.% of an epoxy group-containing vinyl monomer (a3), where the weight average molecular weight is 11,000 to 50,000 and the sulfur content exceeds 0.3 wt.%.SELECTED DRAWING: Figure 1

Inventors:
ARAKI TAKU
SHIBATA TAKUYA
SHIROTANI KOSUKE
Application Number:
JP2016031620A
Publication Date:
August 31, 2017
Filing Date:
February 23, 2016
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08F12/08; C08F2/18; C08L25/06; C08L35/06; C08L67/02