Title:
封止用エポキシ樹脂組成物及びそれを用いた電子部品装置
Document Type and Number:
Japanese Patent JP5572918
Kind Code:
B2
Abstract:
Disclosed is an epoxy resin composition for sealing, which comprises (A) an epoxy resin, (B) a curing agent and (C) a compound having a unit represented by the structural formula (I) and a unit represented by the structural formula (II). The epoxy resin composition has excellent fluidability and low stress generation, while keeping its flame retardancy. (I) (II) wherein R1 represents an alkylene group having 1 to 10 carbon atoms; and R2 and R3 independently represent an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkoxy group having 1to 10 carbon atoms, a univalent organic group having 1 to 10 carbon atoms and having an epoxy group, an univalent organic group having 1 to 10 carbon atoms and having a carboxyl group, or a polyalkylene ether group having 3 to 500 carbon atoms.
Inventors:
Takashi Yamamoto
Ryoichi Ikezawa
Takahiro Horie
Ryoichi Ikezawa
Takahiro Horie
Application Number:
JP2008122396A
Publication Date:
August 20, 2014
Filing Date:
May 08, 2008
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L63/00; C08K5/5419; C08L83/04; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Hidekazu Miyoshi
Yukikuni Iwasaki
Sumio Kawamata
Masakazu Ito
Toshikazu Takahashi
Toshio Takamatsu
Yukikuni Iwasaki
Sumio Kawamata
Masakazu Ito
Toshikazu Takahashi
Toshio Takamatsu