EPOXY RESIN COMPOSITION, HEAT-CONDUCTIVE MATERIAL PRECURSOR, B-STAGE SHEET, PREPREG, HEAT DISSIPATION MATERIAL, LAMINATE, METAL SUBSTRATE AND PRINTED WIRING BOARD

Japanese Patent JP2016113493

A

PROBLEM TO BE SOLVED: To provide an epoxy resin composition capable of forming a cured product having high thermal conductivity; a heat-conductive material precursor; a B-stage sheet; a prepreg; a heat dissipation material having high thermal conductivity; a laminate; a metal substrate; and a printed wiring board.SOLUTION: There is provided an epoxy resin composition which comprises boron nitride particles, a curing agent, glass particles having an aspect ratio of 2 or more and a bisphenol type liquid crystal epoxy monomer. [X represents a single bond or a linking group consisting of the following divalent group including an azo group, an alkene group, an imino group, an ester group and an oxide thereof, an aromatic ring group, an alicyclic group or the like; Y each independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an aliphatic alkoxy group having 1 to 8 carbon atoms, F. Cl, Br, I, a cyano group, a nitro group or an acetyl group; n each independently represents an integer of 0 to 4; k represents an integer of 0 to 7; m represents an integer of 0 to 8; and l represents an integer of 0 to 12.]SELECTED DRAWING: None

TAKEZAWA YOSHITAKA
SONG SHIHUI
YOSHIDA YUKA
TANAKA SHINGO
HOJO FUSAO

JP2014251063A

June 23, 2016

December 11, 2014

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HITACHI CHEMICAL CO LTD

C08L63/00; B32B15/08; B32B15/092; B32B27/04; B32B27/38; C08G59/24; C08J5/24; C08K3/22; C08K3/38; C08K3/40; H05K1/03; H05K1/05

Patent Service Corporation Taiyo International Patent Office

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