Title:
An epoxy resin constituent, an underfill agent, adhesives, and a semiconductor device
Document Type and Number:
Japanese Patent JP6200715
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition, an underfill agent and an adhesive which have high thermal conductivities, and a semiconductor device using the epoxy resin composition.SOLUTION: An epoxy resin composition contains (A) a liquid epoxy resin, (B) an amine curing agent, (C) an inorganic filler, and (D) an amine alkyleneoxide addition product. The (D) component has a structure represented by the following formula (1). In the formula, R represents a hydrogen atom or an alkyl group, and X and Y each independently represent an average addition molar number of oxyalkylene groups.
Inventors:
Masahiro Hasegawa
Application Number:
JP2013153213A
Publication Date:
September 20, 2017
Filing Date:
July 24, 2013
Export Citation:
Assignee:
Namics Co., Ltd.
International Classes:
C08G59/50; C08K3/00; C08K5/17; C08L63/00; C09J11/06; C09J163/00; H01L23/29; H01L23/31; H01L33/56
Domestic Patent References:
| JP2011001451A | ||||
| JP2012522113A | ||||
| JP2011528743A | ||||
| JP2009221464A |
Attorney, Agent or Firm:
Asahi Patent Office
Hiroshi Watanabe
Hiroshi Watanabe
Previous Patent: Stem cell origin growth-factor-production catalyst
Next Patent: A lamination structure and a lamination unit
Next Patent: A lamination structure and a lamination unit