Title:
封止用エポキシ樹脂成形材料及び電子部品装置
Document Type and Number:
Japanese Patent JP4849290
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain an epoxy resin molding material for sealing, free from a halogen and antimony, and having good flame retardancy without reducing the reliability such as moldability, resistance to solder-reflow, moisture resistance and characteristics after being left at high temperatures, and further to provide an electronic part device having an element sealed with the molding material. SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin and (B) a curing agent as essential components, and is regulated so that the epoxy resin (A) may contain an epoxy resin represented by formula (I) (wherein, R<1> , R<2> and R<3> are each selected from hydrogen atom, a substituted or unsabstituted 1-10C hydrocarbon group and a substituted or unsabstituted 1-10C alkoxy group, and are same or different; and (m) and (n) are each an integer of 0-10, with the proviso that the case in which (m) and (n) are simultaneously 0 is omitted) and a crystalline epoxy resin, and the curing agent (B) may contain a phenol resin represented by formula (II) (wherein, R<1> , R<2> and R<3> are each selected from hydrogen atom, a substituted or unsabstituted 1-10C hydrocarbon group and a substituted or unsabstituted 1-10C alkoxy group, and are same or different; and (m) and (n) are each an integer of 0-10).
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Inventors:
Ryoichi Ikezawa
Masakazu Ishiguro
Mitsuo Katayose
Masakazu Ishiguro
Mitsuo Katayose
Application Number:
JP2001193208A
Publication Date:
January 11, 2012
Filing Date:
June 26, 2001
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G59/32; C08G59/62; C08G59/68; C08K3/00; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2001102498A | ||||
| JP2001123046A | ||||
| JP11269349A | ||||
| JP11323090A |