Title:
An epoxy resin molding composition for closure, and a semiconductor device using this
Document Type and Number:
Japanese Patent JP6282390
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin-molding material for sealing, which is excellent in filling properties and can prevent voids from occurring; and to provide a semiconductor apparatus using the same.SOLUTION: The epoxy resin-molding material for sealing includes at least: an epoxy resin (A); a curing agent (B); and an inorganic filler (C). In the epoxy resin (A) and the curing agent (B), a liquid composition comprising the epoxy resin and curing agent has a dynamic contact angle to an insulation protective film of ≤70° at 110°C. The inorganic filler (C) has a mass-average particle diameter of ≤10 μm and specific surface area of ≥3.0 m/g.
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| JPH06157754 | RESIN COMPOSITION |
| JP2004179454 | SEMICONDUCTOR DEVICE |
Inventors:
Takafumi Ito
Takatoshi Ikeuchi
Seiichi Akagi
Mitsuo Togawa
Takatoshi Ikeuchi
Seiichi Akagi
Mitsuo Togawa
Application Number:
JP2011271670A
Publication Date:
February 21, 2018
Filing Date:
December 12, 2011
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08G59/62; C08K3/00; C08L63/00; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2004307646A | ||||
| JP2005225912A | ||||
| JP2008303283A | ||||
| JP2009249424A | ||||
| JP2005247890A |
Foreign References:
| WO2004090033A1 | ||||
| WO2007032424A1 |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office