Title:
封止用エポキシ樹脂成形材料及び電子部品装置
Document Type and Number:
Japanese Patent JP3975386
Kind Code:
B2
Inventors:
Naoki Watanabe
Tatsuo Kawada
Tatsuo Kawada
Application Number:
JP2000023305A
Publication Date:
September 12, 2007
Filing Date:
January 27, 2000
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L63/00; C08L23/06; C08L23/26; C08L35/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP9169830A | ||||
| JP9157497A | ||||
| JP54006094A | ||||
| JP2000017045A |