Title:
An epoxy resin molding composition for element closure, and an electronic component device
Document Type and Number:
Japanese Patent JP6277611
Kind Code:
B2
Inventors:
Kenji Tanaka
Toru Baba
Masakazu Ishiguro
Fumio Furusawa
Toru Baba
Masakazu Ishiguro
Fumio Furusawa
Application Number:
JP2013131893A
Publication Date:
February 14, 2018
Filing Date:
June 24, 2013
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
C08L63/00; C08G59/20; C08K5/34; H01L23/29; H01L23/31
Domestic Patent References:
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Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office
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