Title:
【発明の名称】作業部材の上に金属を電解により沈着させる装置および方法
Document Type and Number:
Japanese Patent JP2002506927
Kind Code:
A
Abstract:
This invention employs a novel approach to the copper metallization of a workpiece, such as a semiconductor workpiece. In accordance with the invention, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent conformal copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.
Inventors:
Lin, Lin Lin
Application Number:
JP2000536908A
Publication Date:
March 05, 2002
Filing Date:
March 22, 1999
Export Citation:
Assignee:
Semi-Tooth Incorporated
International Classes:
C23C28/00; C23C28/02; C25D3/38; C25D5/10; C25D7/12; H01L21/288; H01L21/445; H01L21/768; H05K3/42; (IPC1-7): C25D3/38; C23C28/00; C23C28/02; C25D7/12; H01L21/288; H01L21/445
Domestic Patent References:
| JPH06349952A | 1994-12-22 | |||
| JPH04120290A | 1992-04-21 | |||
| JPH06349952A | 1994-12-22 | |||
| JPH04120290A | 1992-04-21 |
Attorney, Agent or Firm:
Heiyoshi Odashima