Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
等電位ボンディング金具
Document Type and Number:
Japanese Patent JP7153359
Kind Code:
B2
Abstract:
To provide an equipotential bonding metal fitting which can be used as means of connecting a lead wire to a reinforcement in order to protect various electric equipment in a building at lightning when connecting both of the reinforcements or the reinforcement and a steel frame with the lead wire.SOLUTION: A equipotential bonding metal fitting is formed by: a pair of metal nipping tools 1 and 2 nipping a reinforcement R; a reinforcement fastening bolt 22 fastening the pair of metal nipping tools each other; and a lead wire attachment part 6 provided to one of the metal nipping tools. The lead wire attachment part 6 is structured by: a lead wire insertion penetration hole 7 penetrating one metal nipping tool 1 parallel to a length direction of the reinforcement R nipped by the pair of metal nipping tools 1 and 2; a metal lead wire pressing tool 3 inserted into the lead wire insertion penetration hole 7; and a lead wire fastening bolt 15 screwing and penetrating a penetration screw hole 13 penetrating a peripheral wall part of the lead wire insertion penetration hole 7, and in which an inner end is contacted to the lead wire pressing tool 3.SELECTED DRAWING: Figure 2

Inventors:
Akihiro Watanabe
Application Number:
JP2020044006A
Publication Date:
October 14, 2022
Filing Date:
March 13, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Kunimoto Shokai Co., Ltd.
International Classes:
H02G13/00; E04B1/92; E04H9/14; H02G15/08
Domestic Patent References:
JP973929A
JP3225871U
JP5789275U
JP2012164564A
Foreign References:
US20160344112
US6297447
Attorney, Agent or Firm:
Hiroshi Masaki
Yuko Mikami



 
Previous Patent: Improved Tm mapping method

Next Patent: game machine