Title:
How to estimate epidermis thickness
Document Type and Number:
Japanese Patent JP6299457
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epidermis thickness estimating method for estimating an epidermis thickness noninvasively and conveniently.SOLUTION: The image of a cuticle is taken by a microscope from the skin surface of a subject, and the concentration of the distribution of an angiogram (or a loop-shaped capillary vessel density) by the loop-shaped capillary vessel, in which blood is flowing observed in the image. On the basis of the relations acquired from a plurality of persons between the loop-shaped capillary vessel density and the cuticle thickness, the epidermis thickness is estimated from the loop-shaped capillary vessel density of the subject.
Inventors:
Kyoko Amano
Application Number:
JP2014122457A
Publication Date:
March 28, 2018
Filing Date:
June 13, 2014
Export Citation:
Assignee:
Kao Corporation
International Classes:
A61B5/107; A45D44/00; A61B5/00
Domestic Patent References:
| JP11286432A | ||||
| JP2012205855A | ||||
| JP2014104132A |
Foreign References:
| KR1020060115478A |
Attorney, Agent or Firm:
Taji U.S. Patent Office
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