Title:
An etching solution and an etching method using it
Document Type and Number:
Japanese Patent JP6010535
Kind Code:
B2
Abstract:
To provide an etchant for copper oxide, control of the etching rate, and etching method using the same for enabling exposed portions to be selectively etched against unexposed portions in the case of performing exposure with laser light using an oxide of copper as a heat-reactive resist material, an etchant of the invention is an etchant for copper oxide to selectively remove a copper oxide of a particular valence from a copper oxide-containing layer containing copper oxides of different valences, and is characterized by containing at least an amino acid, a chelating agent and water, where a weight percentage of the amino acid is higher than that of the chelating agent, and pH thereof is 3.5 or more.
Inventors:
Nakata Takuto
Yoshikiyo Nakagawa
Yoshikiyo Nakagawa
Application Number:
JP2013522911A
Publication Date:
October 19, 2016
Filing Date:
June 27, 2012
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C09K13/06; H01L21/308
Domestic Patent References:
| JP2011016975A |
Foreign References:
| WO2011105129A1 |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Masayoshi Miwa
Amada Masayuki
Masayoshi Miwa
Previous Patent: six -- ' - full -- Oro - (N-methyl or N, and N- Dimethyl -) - four - phenyl -- four -- ' -- nine -- ...
Next Patent: JPS6010536
Next Patent: JPS6010536