Title:
拡張可能なインプラントデバイス
Document Type and Number:
Japanese Patent JP7337087
Kind Code:
B2
Abstract:
Expandable implant devices including first and second endplates, wherein a first side of the first endplate is moveably attached to a first side of the second endplate; and an expansion mechanism is disposed between the first and second endplates adjacent the second side of the endplates opposite the first side, wherein actuating the expansion mechanism changes an angle between the first endplate and the second endplate.
Inventors:
Beso, Christopher
Sweeney, Thomas, The Third
Sweeney, Thomas, The Third
Application Number:
JP2020552691A
Publication Date:
September 01, 2023
Filing Date:
December 18, 2018
Export Citation:
Assignee:
New Veg, Incorporated
International Classes:
A61F2/44
Foreign References:
| WO2016183382A1 | ||||
| US20130211525 | ||||
| WO2017015165A1 | ||||
| US20170100255 | ||||
| US9750618 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Osamu Miyazaki
Tadahiko Ito
Osamu Miyazaki