Title:
REDUCTION OF CONTENT OF UNPREFERABLE ALIPHATIC HALIDE IN EPOXY RESIN
Document Type and Number:
Japanese Patent JP3042723
Kind Code:
B2
Abstract:
PURPOSE: To reduce the hydrolyzability and the content of bonded halide in epoxy resin by dissolving an epoxy resin into a specified solvent, heating the solution in the presence of a base and cleaning the same.
CONSTITUTION: An epoxy resin which is a glycidyl derivative of a compound contg. active atoms (such as biphenol) is dissolved in a solvent obtd. by combining a polar aprotic solvent which is not a ketone (such as DMF) of 90 to 99.95 wt.% and an organic solvent having an aliphatic hydroxyl group (such as methanol) of 0.5 to 10 wt.%. Next, the epoxy resin is cleaned at 40 to 150°C in the presence of a base of 0.25 to 10 mol (such as KDH) with a soln., preferably, of water, an inorganic acid salt (such as sodium phosphate). The epoxy resin is used in the electronic industry as sealing agents, injecting materials, electric laminated boards or the like, and by reducing the content of halide, the loss of the electric characteristics thereof can be reduced.
Inventors:
Chun S. One
Robert El. Borden
Mark K. Wesels
Robert El. Borden
Mark K. Wesels
Application Number:
JP1735891A
Publication Date:
May 22, 2000
Filing Date:
February 08, 1991
Export Citation:
Assignee:
The Dow Chemical Company
International Classes:
C08G59/00; C08G59/02; C07D301/32; (IPC1-7): C07D301/32; C08G59/02
Domestic Patent References:
| JP62289573A |
Other References:
【文献】米国特許4585838(US,A)
Attorney, Agent or Firm:
Aoki Akira (3 outside)